APPLICATIONS

半导体包装领域

首页 应用领域和产品半导体包装领域

ICF-LFB-L/H

line Feature

  • 半导体QFN/DFN封装用胶带
  • 具有耐热分子设计的PI粘合剂层
  • No Out-gassing, No Residue, No Bleeding
Type ICFTM-LFB (半导体QFN/DFN封装用胶带)
Type L H
Taping Temp(℃) ~100 220~250
De-taping Temp(℃) R.T.* R.T.~200
DecompositeTemp(℃) 300 400
Peel strength after Wire Bond(gf/cm) ~ 190 (200℃, 90min) ~ 300 (200℃, 90min → 230℃, 30min)
Adhesive layer thickness(㎛) 4~5 1
Residue after De-taping None
CTE(ppm/℃) ~ 17

*R.T. : Room Temp